Function features
  • Eliminate static electricity on the surface of the substrate, clean and activate the surface of the substrate, increase the surface energy of the substrate, and improve the adhesion between the adhesive and the substrate.
  • The sprayed plasma has a low temperature and does not damage the substrate.
  • There is no arc and no damage to the chip of the processed product.
Applications Plasma treatment is widely used for surface cleaning and activation of various conductive and non-conductive materials
  • Pad cleaning and activation before PCB solder paste printing
  • Cleaning before PCBA tripartite coating
  • COF, Mini-Led substrate cleaning before dispensing
  • Wire Bonding gold finger cleaning and revitalization
  • Wafer cleaning, etc.
  Plasma System Features and Parameters Features
  • Multi-heads and different power can be configured according to the product processing speed required by customers
  • Different shapes of nozzles can be configured according to the shape of customers’ products
  • Higher and stable discharge voltage ensures consistent concentration of ejected ions
  • The ejected plasma has a low temperature and does not damage the treated substrate
Item unit Single Dual
Input voltage VAC 220± 10%, Single Phase
Input Frequency Hz 50/60
Input current Amp Max 8 per a head
Ground resistance Ω Lower than 10
Input gas NA AIR(CDA), CO2, N2, O2, Ar, Etc
Gas pressure MPa 0.4 ~~0.6
Gas flow rate LPM 25-80
Plasma output Watt 500/1000/1500
Discharge voltage KVolt 8~12
Discharge freq. KHz 30-60
Plasma length mm Max.70
Plasma width mm 20/40/60/80/100/150
Operation ambient temp °C 50
Discharge head q’ty Set 1 2
Discharge head length meter Max 8 per a head