Qualitek utilizes state-of-the-art wire extrusion and wire drawing machines to manufacture low residue/fine diameter wire solders. Many of our formulations use the latest in no-clean/low residue technology found in our solder pastes and solder fluxes. We also developed our flux core manufacturing process to eliminate flux voids and irregular wire. Formulations available for: No-Clean, Water-Soluble, Rosin Mildly Activated, Super Activated Resin and Rosin Activated. Solid wire is also available. Qualitek wire solders meet or exceed J-STD-004B. 

Standard Packaging: Wire solder is packaged on spools sizes: 1/2lb., 1lb., 1 Kilogram, 5lb., 10lb., 20lb., NEW SELECTIVE SOLDER SOLID WIRE 8lb.

1) Leaded (SnPb) / Leadfree 

2) No Clean (NC600) / Water Soluble (WS700) 

3) Metal Alloy 

4) Diameter ( 0.25, 0.4, 0.5, 0.6, 0.8, 1.0, 1.2mm etc) 

5) Packaging (500gm per spool) 

Process: 

1)Manual Soldering 

2)Robotic Soldering