Description

Composition / Information on Ingredients

Our high-performance solder paste is meticulously formulated to meet the demanding requirements of modern electronics manufacturing. It consists of a precise blend of metallic elements and chemical agents, ensuring optimal performance, reliability, and environmental safety.

This optimized alloy composition—comprising primarily Tin, with carefully balanced Silver and Copper content—delivers excellent mechanical strength and wetting characteristics. Modified rosin and glycol ether solvents are added to enhance paste performance, improve spreadability, and ensure consistent reflow profiles.

Physical and Chemical Properties

Our solder paste stands out due to its stable physical and chemical characteristics. These properties have been tested under rigorous quality control protocols to ensure suitability across various production environments.

• Odor: Mild

• Appearance: Paste

• Color: Metallic gray

• Flash Point (Method): > 98°C (209°F)

• Flammable Limits: Not established

• Autoignition Temperature: > 227°C (440°F)

• Vapor Pressure: Not determined

• Vapor Density: Not determined

• Boiling Point (Vehicle): 198°C (388°F)

• Melting Point: 217°C (423°F) to 221°C (430°F) (Please refer to technical bulletin for alloy-specific data)

• Solubility in Water: Partially soluble

• Specific Gravity: 7.31 – 7.47 (water = 1)

These values indicate a highly stable paste with excellent soldering characteristics, suitable for lead-free applications in compliance with RoHS and other environmental standards.

Applications and Benefits

Our solder paste is widely used in the electronics manufacturing industry, particularly in applications involving:

• Surface Mount Technology (SMT)

• Through-hole reflow soldering

• PCB assembly for high-reliability products

• Consumer electronics, automotive electronics, medical devices

Key Benefits:

• Strong Mechanical Bonds: The tin-silver-copper alloy provides excellent joint strength and thermal fatigue resistance.

• High Wetting Performance: Enhances solder flow and minimizes voids.

• Thermal Stability: Capable of withstanding high-temperature processes without degradation.

• Environmentally Friendly: Lead-free formulation in accordance with global environmental directives.

• Consistent Printing Performance: Maintains a stable viscosity profile, reducing printing defects in automated SMT lines.

Technical Insight

The melting range of 217°C to 221°C aligns with most lead-free soldering profiles, ensuring compatibility with common reflow ovens and production equipment. The paste’s metallic gray color and stable consistency make it easy to visually inspect during and after application.

Thanks to its mild odor and controlled solvent release, the paste also contributes to a cleaner, safer working environment for operators, especially in high-throughput settings.

Storage and Handling

To preserve its quality and shelf life, the solder paste should be stored in a tightly closed container under refrigeration (0–10°C). Before use, allow it to reach room temperature without opening the container to avoid condensation. Proper handling ensures optimal paste performance and prolongs stencil life.

Shelf Life:

• Refrigerated Storage: Up to 6 months

• Room Temperature: Use within 24–48 hours once opened

Safety and Compliance

All ingredients comply with international safety and chemical regulations. While the paste contains no hazardous levels of volatile substances under normal usage, we recommend handling it in well-ventilated areas and using appropriate PPE (e.g., gloves, goggles) for extended exposure.

Refer to the product’s Safety Data Sheet (SDS) for detailed handling instructions and first-aid information.

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JIT Industrial Asia Pte Ltd​ | Solutions for Manufacturing Industry

Providing equipment and technology solutions for the electronics manufacturing and automation industries.
Address 1: No.4, Lane 82, Dich Vong Hau, Cau Giay, Hanoi, Vietnam

Address 2: No 6, M1, Phuoc Long B, TP. Thu Duc, TP. Ho Chi Minh

Email: info@jitvietnam.com | Hotline: (+84) 34 810 0358