THERM-A-GAP GEL 75 Thermally Conductive Gel

Feature	Description
High Thermal Conductivity	7.5 W/m-K ensures excellent heat transfer
Easily Dispensable	Suitable for manual & automated applications
No Secondary Curing	Ready-to-use with no extra processing needed
Low Thermal Impedance	Enhances efficiency in heat dissipation
Low Compression Force	Prevents stress on delicate components
Reworkable	Allows for easy modifications & repairs

Categories: Chemicals, Thermal & EMI Materials

Description
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Introduction

In modern electronics, thermal management is crucial. JIT Asia presents THERM-A-GAP GEL 75, a high-performance thermally conductive gel with 7.5 W/m-K thermal conductivity, ideal for heat dissipation in electronic components.

Key Features & Benefits

Feature	Description
High Thermal Conductivity	7.5 W/m-K ensures excellent heat transfer
Easily Dispensable	Suitable for manual & automated applications
No Secondary Curing	Ready-to-use with no extra processing needed
Low Thermal Impedance	Enhances efficiency in heat dissipation
Low Compression Force	Prevents stress on delicate components
Reworkable	Allows for easy modifications & repairs

Technical Specifications

Property	Value
Thermal Conductivity	7.5 W/m-K
Operating Temperature	-67 to 392°F (-55 to 200°C)
Flow Rate	30 g/min
Specific Gravity	3.4
Heat Capacity	1 J/g-K
Coefficient of Thermal Expansion	150 ppm/K
Dielectric Strength	220 VAC/mil
Volume Resistivity	10^14 ohm-cm
Dielectric Constant	7.4 @ 1 MHz
Dissipation Factor	0.003 @ 1 MHz
Flammability Rating	UL 94 V-0
Outgassing Total Mass Loss	0.18% TML (0.05% CVCM)
Minimum Bondline Thickness	0.008 inch (0.20 mm)
Shelf Life	18 months
Material Type	Silicone Rubber (VMQ, PVMQ)

Applications

Industry	Application
Telecom	Heat dissipation in base stations
Power Electronics	Cooling power supplies & semiconductors
Memory Modules	Prevents overheating in power modules
Microprocessors & CPUs	Improves thermal performance of computing devices
Automated Manufacturing	Compatible with dispensing machines

How to Apply

Step	Action
1	Clean surfaces to remove dust & contaminants
2	Apply gel using syringe or automated dispenser
3	Spread evenly for uniform thermal contact
4	Assemble components with light pressure

Why Choose JIT Asia?

At JIT Asia, we provide high-quality thermal management solutions tailored for demanding electronics industries. Our products guarantee efficiency, reliability, and longevity.