Introduction

In today’s fast-paced technological world, maintaining optimal thermal management is crucial for the reliability and performance of electronic devices. JIT ASIA THERM-A-GAP GEL 35VT is a high-performance, one-component, dispensable thermal interface material designed to meet the demanding requirements of modern electronics. With its 3.5 W/m-K thermal conductivity and excellent adaptability, this gel ensures efficient heat transfer while accommodating various applications.

Key Features of THERM-A-GAP GEL 35VT

High Thermal Conductivity

• Thermal conductivity of 3.5 W/m-K efficiently transfers heat away from critical electronic components, preventing overheating and ensuring stable operation.

Excellent Vibration and Pump-Out Resistance

• The “VT” in its name stands for vibration/vertical and tackiness, signifying its robust reliability even in high-vibration environments.

No Mixing or Secondary Curing Required

• Comes ready-to-use, eliminating the need for time-consuming mixing or secondary curing processes, making it an ideal choice for efficient manufacturing and repair work.

High Tackiness and Reworkability

• Ensures proper adhesion, filling gaps effectively and minimizing thermal impedance.
• Reworkable nature allows for easy removal and reapplication during maintenance or upgrades.

Versatile Application and Bond Line Thickness

• Can be dispensed at various bond line thicknesses, adapting to assembly tolerances and optimizing thermal performance.

Technical Specifications

Property	Value
Color	White
Specific Gravity	2.9
Heat Capacity	1 J/g-K
Operating Temperature	-40 to 302 °F (-55 to 200 °C)
Volume Resistivity	10^13 ohm-cm
Dissipation Factor	0.0002 @ 1 MHz
Outgassing Total Mass Loss	0.135% TML (0.0731% CVCM)
Minimum Bond Line Thickness	0.004 inch (0.10 mm)
Flow Rate	23 g/min
Coefficient of Thermal Expansion	150 ppm/K
Dielectric Strength	7.9 VAC/mil
Dielectric Constant	6.8 @ 100 kHz
Flammability Rating	UL 94 V-0
Shelf Life	12 months
Polymer Material Options	Silicone Rubber (VMQ, PVMQ)

Applications of THERM-A-GAP GEL 35VT

THERM-A-GAP GEL 35VT is widely used across multiple industries due to its superior performance and adaptability. Some key applications include:

Telecommunications Infrastructure

• Ensures efficient heat dissipation in high-performance network devices, improving reliability and longevity.

Battery Energy Storage Systems (BESS)

• Helps maintain optimal temperature in battery modules, reducing the risk of overheating and enhancing energy efficiency.

Automotive and ADAS Control Modules

• Supports advanced driver assistance systems (ADAS) by ensuring proper thermal management of sensors and computing units.

Automotive Sensors and Radar

• Provides enhanced thermal interface stability in high-vibration automotive environments.

Power Electronics

• Enhances cooling performance in power modules, reducing thermal stress and improving efficiency.

Consumer Electronics

• Ideal for compact electronic devices such as smartphones, tablets, and gaming consoles where heat dissipation is critical.

Industrial Electronic Equipment

• Ensures long-term thermal reliability in harsh industrial conditions.

Why Choose THERM-A-GAP GEL 35VT?

Feature	Benefit
Proven Reliability	Rigorously tested for vibration and stability
Enhanced Performance	High thermal conductivity with flexible use
Cost-Effective Solution	Minimizes manufacturing complexity
Environmental Compliance	Meets UL 94 V-0 and RoHS standards

Contact Us

Ensure the best thermal management for your electronic components with Parker Chomerics THERM-A-GAP GEL 35VT.

📞 Contact us now for expert consultation!

📍 Website: www.jit-asia.com

📩 Email: info@jitvietnam.com

📞 Hotline: (+84) 348 100 358