THERM-A-GAP PAD 30 Thermally Conductive Gap Filler Pads

In today’s fast-paced electronics industry, effective thermal management is critical to ensuring optimal performance and long-term reliability. At JIT Asia, we offer the advanced THERM-A-GAP PAD 30 Thermally Conductive Gap Filler Pads, designed to bridge the gap between heat sinks and electronic components, providing superior heat dissipation and thermal conductivity.

Whether you’re looking to enhance the performance of telecommunications equipment, automotive electronics, or desktop computers, JIT Asia’s THERM-A-GAP PAD 30 is engineered to meet your needs. Let’s explore the key features, benefits, and technical specifications in detail.

Categories: Chemicals, Thermal & EMI Materials

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Unlock Superior Thermal Management with JIT Asia

Key Features

Our THERM-A-GAP PAD 30 offers an exceptional combination of thermal performance, flexibility, and safety:

Features	Details
Thermal Conductivity	3.2 W/m-K – Exceptional heat dissipation
Soft and Conformable	30 Shore 00 durometer for low deflection force and surface adaptability
Low Outgassing	Reduces contamination in sensitive applications
UL 94 V-0 Flammability Rating	Meets stringent safety and flame-retardant standards
Multiple Thickness Options	Available in standard sheet sizes (9″x9″ and 18″x18″) and customizable sizes

Technical Specifications

The following table provides a comprehensive view of the technical specifications for JIT Asia’s THERM-A-GAP PAD 30:

Parameter	Specification
Thermal Conductivity	3.2 W/m-K
Thermal Impedance	0.6 °C-cm²/W
Durometer Hardness	30 Shore 00
Operating Temperature Range	-67 to 392 °F (-55 to 200 °C)
Heat Capacity	1 J/g-K
Volume Resistivity	10¹³ ohm-cm
Dielectric Strength	150 VAC/mil, 5.9 kVAC/mm
Shelf Life	18 months (“A” carrier) / 36 months (others)
Coefficient of Thermal Expansion	150 ppm/K
Flammability Rating	UL 94 V-0
Specifications Met	RoHS Compliant

Carrier Options

JIT Asia’s THERM-A-GAP PAD 30 comes with various carrier options to suit different applications:

Carrier Type	Description
G – Woven Glass (No PSA)	Provides reinforcement and a low-tack interface for easy repositioning and prototyping
A – Aluminum Foil (with PSA)	Features pressure-sensitive adhesive (PSA) for secure attachment
PN – Polyethylene Napthalate (PEN) Film	Offers dielectric insulation with fair thermal performance
KT – Thermally Enhanced Polyimide	Enhances dielectric strength and allows better shearing motion

Benefits

When you choose JIT Asia’s THERM-A-GAP PAD 30, you’re investing in a high-performance thermal management solution. Below are some key benefits:

Key Benefits	Details
Improved Heat Dissipation	Prevents overheating and enhances device performance
High Energy Efficiency	Reduces thermal resistance for better heat transfer
Custom Sizing Options	Choose thickness and dimensions based on your specific needs
Enhanced Dielectric Strength	Protects sensitive electronics from electrical breakdown
Durable and Long Shelf Life	Shelf life of up to 36 months for most carrier options

Typical Applications

JIT Asia’s THERM-A-GAP PAD 30 is versatile and can be used in a variety of industries, including:

Application	Description
Telecommunications Equipment	Improves heat management in communication systems
Consumer Electronics	Enhances cooling in laptops, servers, and handheld devices
Automotive Electronics (ECUs)	Prevents overheating in electric control units and sensors
Power Conversion Systems	Keeps power supplies and converters running at optimal temperatures
LED Lighting	Extends lifespan and improves efficiency of high-power LEDs
Medical Devices	Ensures stable thermal performance in diagnostic and imaging equipment

Why Choose JIT Asia?

At JIT Asia, we prioritize quality, innovation, and customer satisfaction. Our THERM-A-GAP PAD 30 offers industry-leading thermal performance, custom sizing, and outstanding reliability. With fast delivery, technical support, and flexible product options, JIT Asia is your trusted partner for thermal interface materials.