THERM-A-GAP CIP 35 Thermally Conductive Cure-In-Place Compound

Introduction

In the ever-evolving world of electronics and thermal management, choosing the right thermal interface material is crucial for efficiency and longevity. JIT Asia THERM-A-GAP® CIP 35 is a high-performance, thermally conductive cure-in-place compound designed to provide optimal cooling for sensitive components without excessive compressive force. This two-component dispensable thermal compound offers outstanding thermal conductivity of 3.5 W/m-K, making it ideal for applications that demand high heat dissipation.

Key Benefits of JIT Asia THERM-A-GAP CIP 35

JIT Asia THERM-A-GAP CIP 35 is designed to address the challenges faced in thermal management, ensuring effective heat dissipation while maintaining flexibility and ease of application. Some of its major advantages include:

• High Thermal Conductivity: With a thermal conductivity of 3.5 W/m-K, this compound efficiently transfers heat away from critical components, reducing the risk of overheating.
• Cure-in-Place Design: This versatile thermal compound can be dispensed manually or using robotic systems and cured into complex geometries without requiring additional molds or sheets.
• Silicone-Based Composition: Made with high-quality silicone rubber (VMQ, PVMQ), it provides excellent flexibility, durability, and resistance to environmental stress.
• Filler Materials for Enhanced Performance: Aluminum Oxide and Boron Nitride fillers enhance its heat dissipation capabilities.
• No Need for Additional Processing: Available in ready-to-use cartridges, it eliminates the need for weighing, mixing, or degassing, ensuring a seamless application process.

Technical Specifications

To ensure it meets the demands of high-performance electronic applications, JIT Asia THERM-A-GAP CIP 35 comes with an extensive range of technical features:

• Specific Gravity: 2.87
• Hardness: 55 Shore A
• Viscosity: 5000 P
• Heat Capacity: 1 J/g-K
• Coefficient of Thermal Expansion: 150 ppm/K
• Operating Temperature Range: -67 to 392 °F (-55 to 200 °C)
• Dielectric Strength: 10 KVAC/mm, 250 VAC/mil
• Volume Resistivity: 10^14 (x1) ohm-cm
• Dielectric Constant: 8 @ 1 MHz
• Dissipation Factor: 0.010 @ 1 MHz
• Flammability Rating: UL 94 V-0
• Outgassing Total Mass Loss: 0.22 % TML (0.06% CVCM)
• Shelf Life: 12 Months
• Cure Time: 30 min @ 150°C, 180 min @ 100°C, 48 Hours @ 23°C

Applications of JIT Asia THERM-A-GAP CIP 35

Due to its unique properties and easy application, this cure-in-place thermal compound is widely used in various industries, including:

1. Electronics and Semiconductor Industry

JIT Asia THERM-A-GAP CIP 35 is ideal for heat dissipation in semiconductor chips, power modules, and integrated circuits (ICs). The compound conforms to irregular shapes and multi-height PCB components, providing efficient cooling with minimal mechanical stress.

2. Automotive Electronics

With the increasing demand for electric vehicles (EVs) and hybrid systems, thermal management has become a crucial factor in ensuring longevity and reliability. This compound is widely used in battery thermal management systems (BTMS), power electronics, and onboard chargers.

3. Telecommunications and 5G Infrastructure

Network equipment and 5G base stations require efficient heat dissipation to ensure uninterrupted performance. JIT Asia THERM-A-GAP CIP 35 provides a high-performance cooling solution for RF amplifiers, transceivers, and communication modules.

4. Consumer Electronics

With a vibration-damping feature and long-term reliability, this thermal compound is used in laptops, smartphones, gaming consoles, and smart home devices that require efficient heat management without degradation over time.

5. LED Lighting Systems

High-power LEDs generate significant heat, which can reduce their lifespan if not properly managed. JIT Asia THERM-A-GAP CIP 35 ensures efficient thermal conductivity for LED drivers, COB modules, and high-intensity lighting applications.

Why Choose JIT Asia THERM-A-GAP CIP 35?

JIT Asia THERM-A-GAP CIP 35 stands out due to its exceptional blend of thermal performance, ease of use, and reliability. Here’s why it should be your go-to thermal management solution:

• Dispensable & Conformable: Easily fills gaps, irregular surfaces, and multi-height components.
• No Settling or Degradation: Long shelf life with stable properties over time.
• Sag-Resistant & Vibration Damping: Ensures consistent application without dripping or sagging.
• Multiple Configurations Available: Comes in handheld twin-barrel cartridges, SEMCO® tubes, and pneumatic applicators to suit different application needs.
• High Reliability & Safety: Meets UL 94 V-0 flammability rating, ensuring fire resistance and safety compliance.

How to Apply JIT Asia THERM-A-GAP CIP 35?

Using this thermal compound is simple and efficient:

1. Surface Preparation: Clean the surfaces to remove any dust, grease, or contaminants.
2. Dispensing: Use a handheld applicator, robotic dispenser, or automated system for precise application.
3. Curing Process: Depending on the application temperature, curing can be accelerated at higher temperatures (e.g., 30 min at 150°C or 48 hours at 23°C).
4. Final Inspection: Ensure even coverage and proper adhesion to maximize thermal conductivity.

Conclusion

If you’re looking for a high-performance, reliable, and easy-to-use thermal interface material, JIT Asia THERM-A-GAP CIP 35 is the perfect choice. With its exceptional thermal conductivity, durability, and ease of application, this product provides the ideal solution for advanced electronics cooling across multiple industries.

Don’t compromise on your thermal management needs—choose JIT Asia THERM-A-GAP CIP 35 for superior performance and reliability.

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