THERM-A-GAP CIP 60 Thermally Conductive Cure-In-Place Compound

Introduction

When it comes to advanced thermal management solutions, JIT Asia THERM-A-GAP CIP 60 stands out as a high-performance, two-component (2K) dispensable thermal gap filler. Designed for superior heat dissipation, it effectively replaces traditional thermal pads and ensures efficient thermal conductivity of 6.0 W/m-K. This innovative material provides improved application flexibility and reliability in demanding electronic and automotive applications.

Why Choose JIT Asia THERM-A-GAP CIP 60?

JIT Asia’s THERM-A-GAP CIP 60 is specifically designed to address the limitations of rigid curing thermal interface materials. With its unique composition, it offers a balance of high thermal performance and ease of application, making it ideal for various industries such as automotive, power electronics, and telecommunications.

Key Features

• Superior Thermal Conductivity: With a thermal conductivity of 6.0 W/m-K, it provides excellent heat dissipation.
• Two-Component (2K) Dispensable Material: Allows easy application through both manual and automated dispensing systems.
• Flexible and Conformable: Adapts to irregular surfaces and ensures optimal contact with heat-generating components.
• No Pre-Mixing Required: Eliminates the hassle of weighing or pre-mixing components before application.
• Vibration Dampening Properties: Helps to reduce mechanical stress and enhances long-term reliability.
• Low Outgassing Performance: Reduces the risk of vapor contamination, ensuring long-term stability in sensitive applications.

Technical Specifications

Specification	Value
Filler Material	Aluminum Oxide
Durometer	50 Shore 00
Thermal Conductivity	6.0 W/m-K
Operating Temperature	-58°F to 392°F (-50°C to 200°C)
Volume Resistivity	10¹³ (x1) ohm-cm
Dissipation Factor	0.006 @ 1 MHz
Outgassing Total Mass Loss	0.05% TML (0.01% CVCM)
Maximum Cure Time	60 min @ 100°C, 24 Hours @ 25°C
Specific Gravity	3.2
Dynamic Viscosity	5000 P
Heat Capacity	1 J/g-K
Dielectric Strength	9.3 kVAC/mm, 250 VAC/mil
Dielectric Constant	8 @ 1 MHz
Flammability Rating	UL 94 V-0
Shelf Life	6 Months

Application Methods

JIT Asia THERM-A-GAP CIP 60 is designed for high-volume dispensing applications. It can be applied efficiently using manual or automated dispensing equipment. Its 1:1 mix ratio ensures consistent and uniform application, reducing the chances of errors and improving reliability in thermal interface material (TIM) applications.

Industries & Applications

JIT Asia’s THERM-A-GAP CIP 60 is widely used in high-performance electronic and automotive applications, including:

1. Automotive Industry

• E-mobility applications: Used in power inverters and converters for effective heat dissipation.
• Infotainment systems: Ideal for displays, head-up displays (HUD), and audio components.
• Advanced Driver Assistance Systems (ADAS): Suitable for DCU, cameras, radar, and LiDAR modules.

2. Energy Storage Solutions

• Battery Modules & Energy Storage: Used in residential, commercial, and grid-level energy storage solutions.
• Power Electronics: Ideal for high-power converters, chargers, and industrial power modules.

3. Telecommunications Infrastructure

• Data Centers: Ensures optimal cooling performance in high-density server environments.
• 5G Base Stations: Helps maintain temperature stability in antenna and signal processing units.

Advantages Over Traditional Thermal Pads

Unlike conventional thermal gap filler pads, JIT Asia THERM-A-GAP CIP 60 provides superior thermal performance with greater application flexibility:

• Better Coverage & Adaptability: Conforms to irregular shapes and eliminates air gaps for improved efficiency.
• Higher Reliability: Provides long-term stability with low outgassing and excellent vibration resistance.
• Improved Process Efficiency: No need for custom-cut thermal pads, making it ideal for automated manufacturing processes.

How to Use JIT Asia THERM-A-GAP CIP 60?

Applying JIT Asia THERM-A-GAP CIP 60 is simple and efficient:

1. Surface Preparation: Ensure the surface is clean and dry for optimal adhesion.
2. Dispensing: Use a static mixing tip with manual or automated equipment.
3. Curing Process:
   • 60 minutes at 100°C for faster curing.
   • 24 hours at 25°C for room-temperature curing.
4. Final Inspection: Verify thermal gap coverage and check adhesion strength.

Conclusion

JIT Asia THERM-A-GAP CIP 60 is an industry-leading solution for thermal management applications requiring high conductivity, flexibility, and long-term reliability. Whether you are in automotive, power electronics, or telecommunications, this advanced cure-in-place material is the ideal choice for your thermal interface needs.

Contact us now for expert consultation!
📍 Website: www.jit-asia.com
📩 Email: info@jitvietnam.com
📞 Hotline: (+84) 348 100 358