Description
Introduction
When it comes to advanced thermal management solutions, JIT Asia THERM-A-GAP CIP 60 stands out as a high-performance, two-component (2K) dispensable thermal gap filler. Designed for superior heat dissipation, it effectively replaces traditional thermal pads and ensures efficient thermal conductivity of 6.0 W/m-K. This innovative material provides improved application flexibility and reliability in demanding electronic and automotive applications.
Why Choose JIT Asia THERM-A-GAP CIP 60?
JIT Asia’s THERM-A-GAP CIP 60 is specifically designed to address the limitations of rigid curing thermal interface materials. With its unique composition, it offers a balance of high thermal performance and ease of application, making it ideal for various industries such as automotive, power electronics, and telecommunications.
Key Features
- Superior Thermal Conductivity: With a thermal conductivity of 6.0 W/m-K, it provides excellent heat dissipation.
- Two-Component (2K) Dispensable Material: Allows easy application through both manual and automated dispensing systems.
- Flexible and Conformable: Adapts to irregular surfaces and ensures optimal contact with heat-generating components.
- No Pre-Mixing Required: Eliminates the hassle of weighing or pre-mixing components before application.
- Vibration Dampening Properties: Helps to reduce mechanical stress and enhances long-term reliability.
- Low Outgassing Performance: Reduces the risk of vapor contamination, ensuring long-term stability in sensitive applications.
Technical Specifications
| Specification | Value |
|---|---|
| Filler Material | Aluminum Oxide |
| Durometer | 50 Shore 00 |
| Thermal Conductivity | 6.0 W/m-K |
| Operating Temperature | -58°F to 392°F (-50°C to 200°C) |
| Volume Resistivity | 10¹³ (x1) ohm-cm |
| Dissipation Factor | 0.006 @ 1 MHz |
| Outgassing Total Mass Loss | 0.05% TML (0.01% CVCM) |
| Maximum Cure Time | 60 min @ 100°C, 24 Hours @ 25°C |
| Specific Gravity | 3.2 |
| Dynamic Viscosity | 5000 P |
| Heat Capacity | 1 J/g-K |
| Dielectric Strength | 9.3 kVAC/mm, 250 VAC/mil |
| Dielectric Constant | 8 @ 1 MHz |
| Flammability Rating | UL 94 V-0 |
| Shelf Life | 6 Months |
Application Methods
JIT Asia THERM-A-GAP CIP 60 is designed for high-volume dispensing applications. It can be applied efficiently using manual or automated dispensing equipment. Its 1:1 mix ratio ensures consistent and uniform application, reducing the chances of errors and improving reliability in thermal interface material (TIM) applications.
Industries & Applications
JIT Asia’s THERM-A-GAP CIP 60 is widely used in high-performance electronic and automotive applications, including:
1. Automotive Industry
- E-mobility applications: Used in power inverters and converters for effective heat dissipation.
- Infotainment systems: Ideal for displays, head-up displays (HUD), and audio components.
- Advanced Driver Assistance Systems (ADAS): Suitable for DCU, cameras, radar, and LiDAR modules.
2. Energy Storage Solutions
- Battery Modules & Energy Storage: Used in residential, commercial, and grid-level energy storage solutions.
- Power Electronics: Ideal for high-power converters, chargers, and industrial power modules.
3. Telecommunications Infrastructure
- Data Centers: Ensures optimal cooling performance in high-density server environments.
- 5G Base Stations: Helps maintain temperature stability in antenna and signal processing units.
Advantages Over Traditional Thermal Pads
Unlike conventional thermal gap filler pads, JIT Asia THERM-A-GAP CIP 60 provides superior thermal performance with greater application flexibility:
- Better Coverage & Adaptability: Conforms to irregular shapes and eliminates air gaps for improved efficiency.
- Higher Reliability: Provides long-term stability with low outgassing and excellent vibration resistance.
- Improved Process Efficiency: No need for custom-cut thermal pads, making it ideal for automated manufacturing processes.
How to Use JIT Asia THERM-A-GAP CIP 60?
Applying JIT Asia THERM-A-GAP CIP 60 is simple and efficient:
- Surface Preparation: Ensure the surface is clean and dry for optimal adhesion.
- Dispensing: Use a static mixing tip with manual or automated equipment.
- Curing Process:
- 60 minutes at 100°C for faster curing.
- 24 hours at 25°C for room-temperature curing.
- Final Inspection: Verify thermal gap coverage and check adhesion strength.
Conclusion
JIT Asia THERM-A-GAP CIP 60 is an industry-leading solution for thermal management applications requiring high conductivity, flexibility, and long-term reliability. Whether you are in automotive, power electronics, or telecommunications, this advanced cure-in-place material is the ideal choice for your thermal interface needs.
Contact us now for expert consultation!
📍 Website: www.jit-asia.com
📩 Email: info@jitvietnam.com
📞 Hotline: (+84) 348 100 358
Reviews
There are no reviews yet.