Description
🔧 Overview & Key Features of the SEC-E380S-W
The SEC-E380S-W is a 2-component adhesive / compound dispensing system, equipped with a servo-motor extrusion mechanism, lead-screw drive, and XYZ motion rails that deliver highly accurate metering and dispensing. It is a compact desktop/benchtop machine, yet offers a relatively large working range, suitable for medium and small PCBs or component modules.
The dispensing head uses a precision needle valve, ensuring stable control of AB adhesives, epoxy, silicone, and high-accuracy materials. The machine supports path programming, multi-program storage, and quick job switching for flexible production.
In summary, the SEC-E380S-W is a “small – powerful – precise” dispensing solution designed for electronic assembly environments requiring high-accuracy 2-part material dispensing.
📊 Key Technical Specifications
| Specification | Description |
|---|---|
| Working Range (XYZ) | 380 mm × 380 mm × 100 mm |
| Payload Capacity (Y/Z) | Y-axis: 20 kg, Z-axis: 15 kg |
| Max Movement Speed (XY / Z) | XY: 400 mm/s, Z: 200 mm/s |
| Dispensing Method | Servo-motor extrusion + SMC precision needle valve |
| Position Accuracy (XYZ) | ±0.02 mm (depending on configuration) |
| Resolution | 0.01 mm |
| Program Memory | Supports multiple stored programs (multi-job capability) |
| Power Supply | AC 220V, 50/60 Hz, approx. 0.9 kW |
| Machine Dimensions | L ≈ 520 mm, W ≈ 620 mm, H ≈ 702 mm (varies by model) |
| Machine Weight | Approx. ~80 kg |
✅ Advantages of the SEC-E380S-W
• Compact footprint – ideal for workbenches, small factories, R&D labs, or limited-space production lines.
• High precision & stability – thanks to the servo system and needle valve, ensuring consistent material output for sensitive electronic applications.
• Flexible & easy programming – quick job switching, multi-program storage, suitable for mixed or frequently changing production.
• Good throughput for a benchtop model – with 400 mm/s movement speed.
• Supports various 2-component materials – AB, epoxy, silicone, and high-viscosity adhesives for potting, bonding, sealing, and underfill.
⚠️ Limitations & Considerations
• Working area limit (380 × 380 × 100 mm) — not suitable for large PCBs or modules.
• Payload limitations — intended for small to medium parts.
• Not an industrial full-scale machine — medium throughput; for high-volume production a larger inline model may be needed.
• Material compatibility required — viscosity and curing characteristics must match needle-valve dispensing.
• Requires proper setup and maintenance — needle valves and servo systems need regular cleaning and calibration.
🛠️ Primary Applications of the SEC-E380S-W
The machine is ideal for electronics manufacturing, module assembly, and precision adhesive dispensing:
• 2-component dispensing (AB / epoxy / silicone) for PCBs, modules, and electronic devices
• Bonding, gasketing, sealing small housings, components, and modules
• Potting / encapsulation of sensors, small circuits, and protective electronics
• Underfill / gap filling between components and boards
• Small-to-medium production lines, EMS factories, and prototyping labs
Contact us now for expert consultation!
Website: www.jit-asia.com
Email: info@jitvietnam.com
Hotline: (+84) 348 100 358
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