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691A-HS SOLDER PASTE

Qualitek has developed a unique flux system designed specifically for thermal interface materials. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal).

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Since use of nitrogen is not required, 691A-HS Solder paste will provide excellent cost savings. In addition, 691A-HS Lead Free solder paste exhibits superior joint strength, excellent wettability, extraordinary print definition and tack life. The post soldering residues of 691A-HS are non-conductive, non-corrosive and highly insulated.

Main Features  

  • Halogen Free（Cl<900ppm,Br<900ppm,Cl+Br<1500ppm）
  • Extended stencil life
  • Long tack time
  • Excellent wettability
  • Hard non-conductive residues

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