Qualitek has developed a unique flux system designed specifically for thermal interface materials. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). 

Since use of nitrogen is not required, 691A-HS Solder paste will provide excellent cost savings. In addition, 691A-HS Lead Free solder paste exhibits superior joint strength, excellent wettability, extraordinary print definition and tack life. The post soldering residues of 691A-HS are non-conductive, non-corrosive and highly insulated.

Main Features